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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Speed Grade | 1 |
RoHS Status | RoHS Compliant |
Radiation Hardening | No |
Lead Free | Lead Free |
Factory Lead Time | 8 Weeks |
Packaging | Tray |
Published | 2013 |
Max Operating Temperature | 85°C |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Min Operating Temperature | 0°C |
Frequency | 100MHz |
Speed | 100MHz |
Operating Supply Voltage | 1.5V |
Number of Pins | 256 |
Contact Plating | Copper, Silver, Tin |
Operating Supply Current | 3mA |
Core Architecture | ARM |
Operating Temperature | 0°C~85°C TJ |
RAM Size | 64kB |
Max Frequency | 120MHz |
Core Processor | ARM? Cortex?-M3 |
Architecture | MCU, FPGA |
Peripherals | DMA, POR, WDT |
Max Supply Voltage | 1.575V |
Package / Case | 256-LBGA |
Flash Size | 256KB |
Min Supply Voltage | 1.425V |
Number of Logic Elements/Cells | 2500 |
Supplier Device Package | 256-FPBGA (17×17) |
Memory Size | 4.5kB |
Number of Gates | 200000 |
Series | SmartFusion? |
Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
Number of Registers | 4608 |
Data Rate | 400 kbps |
Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Base Part Number | A2F200 |
Primary Attributes | ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Number of I/O | MCU – 25, FPGA – 66 |
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