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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Part Status | Obsolete |
| Number of Logic Blocks (LABs) | 8 |
| Factory Lead Time | 12 Weeks |
| Packaging | Tray |
| Qualification Status | Not Qualified |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Published | 2015 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1.5V |
| Number of Outputs | 68 |
| Number of Inputs | 68 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Length | 11mm |
| Width | 11mm |
| Subcategory | Field Programmable Gate Arrays |
| Frequency | 80MHz |
| Core Architecture | ARM |
| Peak Reflow Temperature (Cel) | 235 |
| Operating Temperature | -40°C~100°C TJ |
| Core Processor | ARM? Cortex?-M3 |
| Height Seated (Max) | 1.05mm |
| RAM Size | 16kB |
| Architecture | MCU, FPGA |
| Peripherals | DMA, POR, WDT |
| Supply Voltage-Max (Vsup) | 1.575V |
| Number of Terminations | 288 |
| Supply Voltage-Min (Vsup) | 1.425V |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) |
| Interface | EBI/EMI, I2C, SPI, UART, USART |
| Number of Equivalent Gates | 60000 |
| Flash Size | 128KB |
| Series | SmartFusion? |
| Package / Case | 288-TFBGA, CSPBGA |
| Base Part Number | A2F060M3E |
| Primary Attributes | ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Number of I/O | MCU – 28, FPGA – 68 |
| Organization | 1536 CLBS, 60000 GATES |
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