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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
RoHS Status | RoHS Compliant |
Part Status | Obsolete |
Number of Logic Blocks (LABs) | 8 |
Packaging | Tray |
Max Operating Temperature | 85°C |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Min Operating Temperature | 0°C |
Frequency | 100MHz |
Speed | 100MHz |
Max Frequency | 100MHz |
Operating Supply Voltage | 1.5V |
Number of Pins | 256 |
Core Architecture | ARM |
Operating Temperature | 0°C~85°C TJ |
Core Processor | ARM? Cortex?-M3 |
RAM Size | 16kB |
Architecture | MCU, FPGA |
Peripherals | DMA, POR, WDT |
Max Supply Voltage | 1.575V |
Package / Case | 256-LBGA |
Min Supply Voltage | 1.425V |
Supplier Device Package | 256-FPBGA (17×17) |
Connectivity | EBI/EMI, I2C, SPI, UART/USART |
Interface | EBI/EMI, I2C, SPI, UART, USART |
Flash Size | 128KB |
Series | SmartFusion? |
Base Part Number | A2F060M3E |
Primary Attributes | ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops |
Number of I/O | MCU – 26, FPGA – 66 |
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