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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | Non-RoHS Compliant |
| Part Status | Obsolete |
| Number of Logic Blocks (LABs) | 8 |
| Packaging | Tray |
| Min Operating Temperature | -40°C |
| Published | 2015 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Frequency | 100MHz |
| Speed | 100MHz |
| Max Frequency | 100MHz |
| Max Operating Temperature | 100°C |
| Core Architecture | ARM |
| Operating Temperature | -40°C~100°C TJ |
| Core Processor | ARM? Cortex?-M3 |
| RAM Size | 16kB |
| Architecture | MCU, FPGA |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Interface | EBI/EMI, I2C, SPI, UART, USART |
| Flash Size | 128KB |
| Factory Lead Time | 99 Weeks |
| Series | SmartFusion? |
| Package / Case | 288-TFBGA, CSPBGA |
| Supplier Device Package | 288-CSP (11×11) |
| Base Part Number | A2F060M3E |
| Primary Attributes | ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Number of I/O | MCU – 28, FPGA – 68 |
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