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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Mount | Surface Mount |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
ECCN Code | EAR99 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Moisture Sensitivity Level (MSL) | 4 |
Pbfree Code | no |
Lead Free | Contains Lead |
Operating Temperature (Min) | -40°C |
Peak Reflow Temperature (Cel) | 260 |
Operating Temperature (Max) | 85°C |
Terminal Pitch | 1mm |
HTS Code | 8542.39.00.01 |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Factory Lead Time | 19 Weeks |
Terminal Form | BALL |
JESD-609 Code | e1 |
Supply Voltage | 1.2V |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Published | 1999 |
Contact Plating | Copper, Silver, Tin |
Length | 19mm |
Width | 19mm |
Telecom IC Type | TELECOM CIRCUIT |
Number of Terminations | 324 |
Number of Pins | 324 |
Pin Count | 324 |
Package / Case | FCBGA |
Height Seated (Max) | 3.42mm |
Thickness | 3.27mm |
*The following components have specifications similar
*The following five components have specifications similar