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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Mount | Surface Mount |
| RoHS Status | RoHS Compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Moisture Sensitivity Level (MSL) | 4 |
| Temperature Grade | COMMERCIAL |
| Pbfree Code | no |
| Published | 2016 |
| Lead Free | Contains Lead |
| Technology | CMOS |
| Operating Temperature (Max) | 70°C |
| Factory Lead Time | 18 Weeks |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| JESD-609 Code | e1 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Peak Reflow Temperature (Cel) | 245 |
| Contact Plating | Copper, Silver, Tin |
| Length | 21mm |
| Width | 21mm |
| Supply Voltage-Min (Vsup) | 0.95V |
| Number of Terminations | 400 |
| Number of Pins | 400 |
| Pin Count | 400 |
| Supply Voltage-Max (Vsup) | 1.05V |
| Package / Case | FCBGA |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Height | 2.75mm |
| Thickness | 2.75mm |
| ECCN Code | 5A002.A.1.A |
*The following components have specifications similar
*The following five components have specifications similar
