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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Pbfree Code | yes |
RoHS Status | Non-RoHS Compliant |
Surface Mount | YES |
Lead Free | Lead Free |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Factory Lead Time | 12 Weeks |
Moisture Sensitivity Level (MSL) | 4 |
Published | 2016 |
Operating Temperature (Min) | -40°C |
Technology | CMOS |
Operating Temperature (Max) | 85°C |
HTS Code | 8542.39.00.01 |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Supply Voltage | 1V |
JESD-609 Code | e1 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Peak Reflow Temperature (Cel) | 245 |
Length | 21mm |
Width | 21mm |
Supply Voltage-Min (Vsup) | 0.95V |
Number of Terminations | 400 |
Number of Pins | 400 |
Pin Count | 400 |
Supply Voltage-Max (Vsup) | 1.05V |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Thickness | 2.75mm |
Height Seated (Max) | 2.83mm |
*The following components have specifications similar
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