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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
ECCN Code | EAR99 |
Retransmit Capability | No |
Output Enable | YES |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Pbfree Code | no |
FWFT Support | Yes |
Lead Free | Contains Lead |
JESD-609 Code | e0 |
Technology | CMOS |
Contact Plating | Lead, Tin |
Time@Peak Reflow Temperature-Max (s) | 20 |
Max Operating Temperature | 70°C |
Packaging | Tape & Reel |
Element Configuration | Dual |
Factory Lead Time | 7 Weeks |
Published | 2009 |
Terminal Pitch | 1mm |
Terminal Position | BOTTOM |
Min Operating Temperature | 0°C |
Terminal Form | BALL |
Bus Directional | Unidirectional |
Height Seated (Max) | 3.5mm |
Number of Terminations | 256 |
Number of Pins | 256 |
Pin Count | 256 |
Peak Reflow Temperature (Cel) | 225 |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Length | 17mm |
Width | 17mm |
Frequency (Max) | 133MHz |
Parallel/Serial | PARALLEL |
Min Supply Voltage | 3.15V |
Cycle Time | 7.5 ns |
Access Time (Max) | 4 ns |
Subcategory | FIFOs |
HTS Code | 8542.32.00.71 |
Memory IC Type | OTHER FIFO |
Max Supply Voltage | 3.45V |
Standby Current-Max | 0.01A |
Supply Current-Max | 0.1mA |
Thickness | 1.76mm |
Memory Density | 2359296 bit |
Organization | 128KX18 |
Additional Feature | ALTERNATIVE MEMORY WIDTH:9-BIT |
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