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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
RoHS Status | RoHS Compliant |
Pbfree Code | yes |
Radiation Hardening | No |
Lead Free | Lead Free |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 70°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Factory Lead Time | 7 Weeks |
Published | 2009 |
Terminal Position | BOTTOM |
Interface | Parallel |
Min Operating Temperature | 0°C |
Frequency | 100MHz |
Frequency (Max) | 100MHz |
Thickness | 1.2mm |
Terminal Form | BALL |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Length | 15mm |
Width | 13mm |
Sync/Async | Synchronous |
I/O Type | COMMON |
Max Supply Voltage | 3.465V |
Min Supply Voltage | 3.135V |
Number of Pins | 165 |
Number of Terminations | 165 |
Pin Count | 165 |
Standby Current-Max | 0.05A |
Subcategory | SRAMs |
Access Time | 8 ns |
Address Bus Width | 18b |
Nominal Supply Current | 210mA |
Word Size | 36b |
Memory Type | RAM, SDR, SRAM |
Density | 9 Mb |
Additional Feature | FLOW-THROUGH ARCHITECTURE |
Memory Size | 1.1MB |
Organization | 256KX36 |
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