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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
RoHS Status | RoHS Compliant |
Factory Lead Time | 12 Weeks |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Pbfree Code | no |
Lead Free | Contains Lead |
Qualification Status | Not Qualified |
JESD-609 Code | e0 |
Technology | CMOS |
Time@Peak Reflow Temperature-Max (s) | 20 |
Max Operating Temperature | 70°C |
Published | 2007 |
Terminal Position | BOTTOM |
Interface | Parallel |
Min Operating Temperature | 0°C |
Thickness | 1.2mm |
Terminal Form | BALL |
Output Characteristics | 3-STATE |
Length | 15mm |
Peak Reflow Temperature (Cel) | 225 |
Width | 13mm |
Frequency | 150MHz |
Frequency (Max) | 150MHz |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Sync/Async | Synchronous |
I/O Type | COMMON |
Max Supply Voltage | 3.465V |
Min Supply Voltage | 3.135V |
Number of Pins | 165 |
Number of Terminations | 165 |
Pin Count | 165 |
Standby Current-Max | 0.05A |
Subcategory | SRAMs |
Address Bus Width | 18b |
Additional Feature | PIPELINED ARCHITECTURE |
Word Size | 36b |
Memory Type | RAM, SDR, SRAM |
Access Time | 3.8 ns |
Density | 9 Mb |
Memory Size | 1.1MB |
Organization | 256KX36 |
Nominal Supply Current | 305mA |
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