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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
RoHS Status | RoHS Compliant |
Radiation Hardening | No |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Pbfree Code | no |
Lead Free | Contains Lead |
Min Operating Temperature | -40°C |
JESD-609 Code | e0 |
Technology | CMOS |
Max Operating Temperature | 85°C |
Time@Peak Reflow Temperature-Max (s) | 20 |
Factory Lead Time | 7 Weeks |
Published | 2005 |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Interface | Parallel |
Terminal Form | BALL |
Length | 14mm |
Output Characteristics | 3-STATE |
Peak Reflow Temperature (Cel) | 225 |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Width | 22mm |
Sync/Async | Synchronous |
I/O Type | COMMON |
Max Supply Voltage | 3.465V |
Min Supply Voltage | 3.135V |
Frequency | 133MHz |
Subcategory | SRAMs |
Package / Case | BGA |
Word Size | 18b |
Additional Feature | PIPELINED ARCHITECTURE |
Height Seated (Max) | 2.36mm |
Nominal Supply Current | 320mA |
Pin Count | 119 |
Number of Terminations | 119 |
Number of Pins | 119 |
Memory Type | RAM, SRAM |
Address Bus Width | 19b |
Standby Current-Max | 0.06A |
Access Time | 4.2 ns |
Density | 9 Mb |
Thickness | 2.15mm |
*The following components have specifications similar
*The following five components have specifications similar