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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Lead Free | Lead Free |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Factory Lead Time | 7 Weeks |
| Published | 2009 |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Length | 14mm |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Width | 22mm |
| Sync/Async | Synchronous |
| Max Supply Voltage | 3.465V |
| Min Supply Voltage | 3.135V |
| Package / Case | BGA |
| Address Bus Width | 18b |
| Word Size | 36b |
| Memory Type | RAM, SDR, SRAM |
| Pin Count | 119 |
| Number of Terminations | 119 |
| Number of Pins | 119 |
| Access Time | 8.5 ns |
| Nominal Supply Current | 225mA |
| Density | 9 Mb |
| Thickness | 2.15mm |
| Memory Size | 1.1MB |
| Organization | 256KX36 |
| Frequency | 91MHz |
| Additional Feature | FLOW-THROUGH |
*The following components have specifications similar
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