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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Functions | 1 |
| Number of Ports | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Lead Free | Lead Free |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Published | 2013 |
| Min Operating Temperature | -40°C |
| Terminal Form | GULL WING |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Terminal Position | QUAD |
| Number of Terminations | 100 |
| Number of Pins | 100 |
| Pin Count | 100 |
| Temperature Grade | INDUSTRIAL |
| Terminal Pitch | 0.65mm |
| Part Status | Discontinued |
| Interface | Parallel |
| Frequency (Max) | 100MHz |
| Thickness | 1.4mm |
| Width | 14mm |
| Output Characteristics | 3-STATE |
| Length | 20mm |
| Terminal Finish | Matte Tin (Sn) – annealed |
| Max Supply Voltage | 3.63V |
| I/O Type | COMMON |
| Min Supply Voltage | 3.135V |
| Memory Size | 128kB |
| Subcategory | SRAMs |
| Package / Case | TQFP |
| Access Time | 5 ns |
| Additional Feature | PIPELINED ARCHITECTURE |
| Memory Type | RAM, SDR, SRAM |
| Density | 1 Mb |
| Supply Current-Max | 0.2mA |
| Address Bus Width | 15b |
| Organization | 32KX32 |
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