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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| RoHS Status | RoHS Compliant |
| Radiation Hardening | No |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Pbfree Code | no |
| Lead Free | Contains Lead |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Max Operating Temperature | 70°C |
| Packaging | Tape & Reel |
| Published | 2009 |
| Factory Lead Time | 11 Weeks |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Thickness | 1.2mm |
| Terminal Form | BALL |
| Output Characteristics | 3-STATE |
| Length | 15mm |
| Peak Reflow Temperature (Cel) | 225 |
| Width | 13mm |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Sync/Async | Synchronous |
| I/O Type | COMMON |
| Max Supply Voltage | 3.465V |
| Min Supply Voltage | 3.135V |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Pin Count | 165 |
| Subcategory | SRAMs |
| Standby Current-Max | 0.03A |
| Access Time | 7.5 ns |
| Package / Case | FBGA |
| Word Size | 36b |
| Memory Type | RAM, SRAM |
| Address Bus Width | 17b |
| Additional Feature | FLOW-THROUGH ARCHITECTURE |
| Density | 4.5 Mb |
| Frequency | 117MHz |
| Nominal Supply Current | 255mA |
*The following components have specifications similar
*The following five components have specifications similar
