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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Mount | Surface Mount |
Number of Functions | 1 |
Number of Ports | 1 |
RoHS Status | RoHS Compliant |
Pbfree Code | yes |
Radiation Hardening | No |
JESD-609 Code | e3 |
Lead Free | Lead Free |
Factory Lead Time | 12 Weeks |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Terminal Form | GULL WING |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 70°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Published | 2009 |
Terminal Position | QUAD |
Number of Terminations | 100 |
Number of Pins | 100 |
Pin Count | 100 |
Terminal Pitch | 0.65mm |
Interface | Parallel |
Min Operating Temperature | 0°C |
Thickness | 1.4mm |
Width | 14mm |
Output Characteristics | 3-STATE |
Length | 20mm |
Terminal Finish | Matte Tin (Sn) – annealed |
Sync/Async | Synchronous |
I/O Type | COMMON |
Max Supply Voltage | 3.465V |
Min Supply Voltage | 3.135V |
Frequency | 166MHz |
Frequency (Max) | 166MHz |
Subcategory | SRAMs |
Standby Current-Max | 0.03A |
Package / Case | TQFP |
Additional Feature | PIPELINED ARCHITECTURE |
Nominal Supply Current | 320mA |
Memory Size | 512kB |
Word Size | 36b |
Memory Type | RAM, SDR, SRAM |
Access Time | 3.5 ns |
Address Bus Width | 17b |
Density | 4.5 Mb |
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