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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Number of Functions | 1 |
Number of Ports | 1 |
RoHS Status | RoHS Compliant |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
JESD-609 Code | e3 |
Lead Free | Lead Free |
Factory Lead Time | 12 Weeks |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Published | 2011 |
Max Operating Temperature | 70°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Terminal Position | QUAD |
Number of Terminations | 100 |
Number of Pins | 100 |
Pin Count | 100 |
Terminal Pitch | 0.65mm |
Interface | Parallel |
Min Operating Temperature | 0°C |
Terminal Form | FLAT |
Thickness | 1.4mm |
Width | 14mm |
Output Characteristics | 3-STATE |
Length | 20mm |
Terminal Finish | Matte Tin (Sn) – annealed |
Frequency | 150MHz |
Frequency (Max) | 150MHz |
I/O Type | COMMON |
Max Supply Voltage | 3.465V |
Min Supply Voltage | 3.135V |
Subcategory | SRAMs |
Package / Case | TQFP |
Additional Feature | PIPELINED ARCHITECTURE |
Memory Size | 512kB |
Memory Type | RAM, SDR, SRAM |
Address Bus Width | 17b |
Standby Current-Max | 0.04A |
Access Time | 3.8 ns |
Density | 4.5 Mb |
Supply Current-Max | 0.325mA |
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