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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Number of Functions | 1 |
Number of Ports | 1 |
RoHS Status | RoHS Compliant |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
Lead Free | Lead Free |
Factory Lead Time | 8 Weeks |
Moisture Sensitivity Level (MSL) | 3 |
Min Operating Temperature | -40°C |
Technology | CMOS |
Published | 2012 |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 85°C |
Supply Voltage | 2.5V |
Operating Supply Voltage | 2.5V |
Packaging | Tape & Reel |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Interface | Parallel |
Terminal Form | BALL |
JESD-609 Code | e1 |
Length | 14mm |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Width | 22mm |
I/O Type | COMMON |
Supply Voltage-Min (Vsup) | 2.375V |
Supply Voltage-Max (Vsup) | 2.625V |
Frequency | 166MHz |
Subcategory | SRAMs |
Package / Case | BGA |
Additional Feature | PIPELINED ARCHITECTURE |
Height Seated (Max) | 2.36mm |
Pin Count | 119 |
Number of Terminations | 119 |
Number of Pins | 119 |
Memory Type | RAM, SRAM |
Access Time (Max) | 3.5 ns |
Standby Current-Max | 0.06A |
Address Bus Width | 20b |
Standby Voltage-Min | 2.38V |
Density | 18 Mb |
Thickness | 2.15mm |
Supply Current-Max | 0.265mA |
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