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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Lead Free | Lead Free |
| Factory Lead Time | 8 Weeks |
| Moisture Sensitivity Level (MSL) | 3 |
| Min Operating Temperature | -40°C |
| Technology | CMOS |
| Published | 2012 |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Supply Voltage | 2.5V |
| Operating Supply Voltage | 2.5V |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Length | 14mm |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Frequency | 150MHz |
| Frequency (Max) | 150MHz |
| Width | 22mm |
| Sync/Async | Synchronous |
| I/O Type | COMMON |
| Min Supply Voltage | 2.375V |
| Max Supply Voltage | 2.625V |
| Subcategory | SRAMs |
| Package / Case | BGA |
| Additional Feature | PIPELINED ARCHITECTURE |
| Height Seated (Max) | 2.36mm |
| Word Size | 36b |
| Memory Type | RAM, SDR, SRAM |
| Pin Count | 119 |
| Number of Terminations | 119 |
| Number of Pins | 119 |
| Address Bus Width | 19b |
| Standby Current-Max | 0.06A |
| Access Time | 3.8 ns |
| Standby Voltage-Min | 2.38V |
| Density | 18 Mb |
| Thickness | 2.15mm |
| Nominal Supply Current | 235mA |
| Memory Size | 2.3MB |
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