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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Functions | 1 |
| Number of Ports | 1 |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Lead Free | Lead Free |
| Terminal Position | DUAL |
| Supply Voltage | 5V |
| Operating Supply Voltage | 5V |
| Power Supplies | 5V |
| Moisture Sensitivity Level (MSL) | 3 |
| Min Operating Temperature | -40°C |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 5.5V |
| Factory Lead Time | 7 Weeks |
| Published | 2009 |
| Number of Terminations | 28 |
| Number of Pins | 28 |
| Pin Count | 28 |
| Temperature Grade | INDUSTRIAL |
| Min Supply Voltage | 4.5V |
| Interface | Parallel |
| Terminal Form | J BEND |
| Output Characteristics | 3-STATE |
| Terminal Finish | Matte Tin (Sn) – annealed |
| I/O Type | COMMON |
| Access Time | 20 ns |
| Subcategory | SRAMs |
| Width | 7.6mm |
| Thickness | 2.67mm |
| Memory Size | 8kB |
| Length | 17.9mm |
| Height Seated (Max) | 3.556mm |
| Density | 64 kb |
| Organization | 8KX8 |
| Address Bus Width | 13b |
| Memory Type | RAM, SDR, SRAM – Asynchronous |
*The following components have specifications similar
*The following five components have specifications similar
