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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Ports | 2 |
| Packaging | Bulk |
| Mount | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Radiation Hardening | No |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Pbfree Code | no |
| Lead Free | Contains Lead |
| Min Operating Temperature | -40°C |
| JESD-609 Code | e0 |
| Terminal Form | GULL WING |
| Technology | CMOS |
| Max Operating Temperature | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Min Supply Voltage | 3V |
| Standby Voltage-Min | 3V |
| Factory Lead Time | 7 Weeks |
| Height Seated (Max) | 1.6mm |
| Published | 2008 |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Temperature Grade | INDUSTRIAL |
| Max Supply Voltage | 3.6V |
| Interface | Parallel |
| Frequency | 100MHz |
| Thickness | 1.4mm |
| Width | 14mm |
| Output Characteristics | 3-STATE |
| Length | 20mm |
| Number of Pins | 128 |
| Number of Terminations | 128 |
| Pin Count | 128 |
| Peak Reflow Temperature (Cel) | 225 |
| Word Size | 16b |
| Terminal Finish | Tin/Lead (Sn85Pb15) |
| Sync/Async | Synchronous |
| I/O Type | COMMON |
| Subcategory | SRAMs |
| Memory Size | 32kB |
| Package / Case | TQFP |
| Access Time | 7 ns |
| Nominal Supply Current | 370mA |
| Memory Type | RAM, SDR, SRAM |
| Density | 512 kb |
| Address Bus Width | 14b |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Organization | 16KX16 |
*The following components have specifications similar
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