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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Ports | 2 |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Lead Free | Lead Free |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Terminal Form | GULL WING |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Supply Voltage-Min (Vsup) | 3V |
| Factory Lead Time | 7 Weeks |
| Height Seated (Max) | 1.6mm |
| Published | 2009 |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Number of Terminations | 100 |
| Number of Pins | 100 |
| Pin Count | 100 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Thickness | 1.4mm |
| Length | 14mm |
| Width | 14mm |
| Terminal Finish | Matte Tin (Sn) – annealed |
| Access Time (Max) | 15 ns |
| Package / Case | LQFP |
| Memory Type | RAM, SRAM |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Density | 144 kb |
| Address Bus Width | 28b |
| Organization | 16KX9 |
*The following components have specifications similar
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