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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Number of Ports | 2 |
Mount | Surface Mount |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
Radiation Hardening | No |
Supply Voltage | 3.3V |
Operating Supply Voltage | 3.3V |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Pbfree Code | no |
Lead Free | Contains Lead |
JESD-609 Code | e0 |
Technology | CMOS |
Max Operating Temperature | 70°C |
Factory Lead Time | 7 Weeks |
Published | 2009 |
Terminal Position | BOTTOM |
Terminal Pitch | 0.8mm |
Interface | Parallel |
Min Operating Temperature | 0°C |
Terminal Form | BALL |
Height | 1.4mm |
Thickness | 1.4mm |
Output Characteristics | 3-STATE |
Length | 15mm |
Width | 15mm |
Peak Reflow Temperature (Cel) | 225 |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Sync/Async | Synchronous |
I/O Type | COMMON |
Frequency | 166MHz |
Access Time | 20 ns |
Number of Terminations | 208 |
Number of Pins | 208 |
Pin Count | 208 |
Subcategory | SRAMs |
Min Supply Voltage | 3.15V |
Address Bus Width | 18b |
Word Size | 36b |
Max Supply Voltage | 3.45V |
Memory Type | RAM, SDR, SRAM |
Nominal Supply Current | 790mA |
Max Supply Current | 790mA |
Standby Current-Max | 0.015A |
Density | 9 Mb |
Memory Size | 1.1MB |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
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