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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Ports | 2 |
| Packaging | Bulk |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Moisture Sensitivity Level (MSL) | 3 |
| Temperature Grade | COMMERCIAL |
| Technology | CMOS |
| Factory Lead Time | 16 Weeks |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Published | 2009 |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Terminal Pitch | 0.8mm |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Length | 15mm |
| Height Seated (Max) | 1.7mm |
| I/O Type | COMMON |
| Frequency | 166MHz |
| Frequency (Max) | 166MHz |
| Number of Terminations | 208 |
| Number of Pins | 208 |
| Pin Count | 208 |
| Subcategory | SRAMs |
| Min Supply Voltage | 3.15V |
| Standby Current-Max | 0.03A |
| Memory Size | 256kB |
| Max Supply Voltage | 3.45V |
| Memory Type | RAM, SDR, SRAM |
| Supply Current-Max | 0.5mA |
| Access Time | 3.6 ns |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Address Bus Width | 34b |
| Density | 2.3 Mb |
*The following components have specifications similar
*The following five components have specifications similar
