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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Ports | 2 |
| Number of Functions | 1 |
| Moisture Sensitivity Level (MSL) | 1 |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Lead Free | Lead Free |
| Supply Voltage | 3.3V |
| Operating Supply Voltage | 3.3V |
| Temperature Grade | COMMERCIAL |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 70°C |
| Min Supply Voltage | 3V |
| Standby Voltage-Min | 3V |
| Factory Lead Time | 7 Weeks |
| Published | 2009 |
| Terminal Position | QUAD |
| Max Supply Voltage | 3.6V |
| Interface | Parallel |
| Min Operating Temperature | 0°C |
| Terminal Form | J BEND |
| Output Characteristics | 3-STATE |
| Terminal Finish | Matte Tin (Sn) – annealed |
| Number of Terminations | 68 |
| Number of Pins | 68 |
| Pin Count | 68 |
| I/O Type | COMMON |
| Access Time | 15 ns |
| Length | 24mm |
| Width | 24mm |
| Subcategory | SRAMs |
| Memory Size | 8kB |
| Package / Case | PLCC |
| Memory Type | RAM, SDR, SRAM |
| Thickness | 3.63mm |
| Density | 64 kb |
| Organization | 8KX8 |
| Address Bus Width | 26b |
| Supply Current-Max | 0.185mA |
*The following components have specifications similar
*The following five components have specifications similar
