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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Number of Ports | 2 |
Packaging | Bulk |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
Lead Free | Lead Free |
Moisture Sensitivity Level (MSL) | 3 |
Min Operating Temperature | -40°C |
Technology | CMOS |
Published | 2012 |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 85°C |
Supply Voltage | 2.5V |
Operating Supply Voltage | 2.5V |
Time@Peak Reflow Temperature-Max (s) | 30 |
Factory Lead Time | 7 Weeks |
Terminal Pitch | 1mm |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Interface | Parallel |
Terminal Form | BALL |
JESD-609 Code | e1 |
Thickness | 1.4mm |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Number of Terminations | 256 |
Number of Pins | 256 |
Pin Count | 256 |
Length | 17mm |
Width | 17mm |
Height Seated (Max) | 1.7mm |
I/O Type | COMMON |
Access Time | 10 ns |
Min Supply Voltage | 2.4V |
Subcategory | SRAMs |
Max Supply Voltage | 2.6V |
Memory Type | RAM, SDR, SRAM |
Density | 9 Mb |
Memory Size | 1.1MB |
Address Bus Width | 38b |
Supply Current-Max | 0.445mA |
*The following components have specifications similar
*The following five components have specifications similar