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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Ports | 2 |
| Mount | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Lead Free | Lead Free |
| Moisture Sensitivity Level (MSL) | 3 |
| Min Operating Temperature | -40°C |
| Technology | CMOS |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Supply Voltage | 2.5V |
| Operating Supply Voltage | 2.5V |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Factory Lead Time | 14 Weeks |
| Published | 2010 |
| Terminal Pitch | 1mm |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Sync/Async | Synchronous |
| I/O Type | COMMON |
| Min Supply Voltage | 2.4V |
| Frequency | 133MHz |
| Frequency (Max) | 133MHz |
| Length | 19mm |
| Width | 19mm |
| Nominal Supply Current | 900mA |
| Subcategory | SRAMs |
| Max Supply Voltage | 2.6V |
| Package / Case | BGA |
| Number of Terminations | 324 |
| Number of Pins | 324 |
| Pin Count | 324 |
| Memory Type | RAM, SDR, SRAM |
| Address Bus Width | 17b |
| Access Time | 4.2 ns |
| Density | 9 Mb |
| Memory Size | 1.1MB |
| Word Size | 72b |
| Thickness | 1.76mm |
| Additional Feature | PIPELINED OR FLOW-THROUGH ARCHITECTURE |
*The following components have specifications similar
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