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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Number of Ports | 2 |
| Packaging | Bulk |
| Mount | Surface Mount |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| Radiation Hardening | No |
| Moisture Sensitivity Level (MSL) | 3 |
| Pbfree Code | no |
| Lead Free | Contains Lead |
| Min Operating Temperature | -40°C |
| JESD-609 Code | e0 |
| Technology | CMOS |
| Max Operating Temperature | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Supply Voltage | 2.5V |
| Operating Supply Voltage | 2.5V |
| Factory Lead Time | 14 Weeks |
| Published | 2009 |
| Terminal Pitch | 1mm |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Terminal Form | BALL |
| Output Characteristics | 3-STATE |
| Number of Terminations | 256 |
| Number of Pins | 256 |
| Pin Count | 256 |
| Peak Reflow Temperature (Cel) | 225 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Sync/Async | Synchronous |
| Length | 17mm |
| Width | 17mm |
| I/O Type | COMMON |
| Min Supply Voltage | 2.4V |
| Frequency | 133MHz |
| Frequency (Max) | 133MHz |
| Subcategory | SRAMs |
| Max Supply Voltage | 2.6V |
| Package / Case | BGA |
| Word Size | 36b |
| Memory Type | RAM, SDR, SRAM |
| Access Time | 4.2 ns |
| Standby Current-Max | 0.08A |
| Density | 36 Mb |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| Organization | 1MX36 |
| Thickness | 1.76mm |
| Nominal Supply Current | 1.37A |
| Address Bus Width | 40b |
| Memory Size | 4.5MB |
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