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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Part Status | Active |
Number of Ports | 2 |
Mount | Surface Mount |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
Pbfree Code | yes |
Radiation Hardening | No |
Lead Free | Lead Free |
Moisture Sensitivity Level (MSL) | 3 |
Temperature Grade | COMMERCIAL |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 2.5V |
Operating Supply Voltage | 2.5V |
Max Operating Temperature | 70°C |
Time@Peak Reflow Temperature-Max (s) | 30 |
Factory Lead Time | 14 Weeks |
Published | 2009 |
Terminal Pitch | 1mm |
Terminal Position | BOTTOM |
Interface | Parallel |
Min Operating Temperature | 0°C |
Terminal Form | BALL |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Number of Terminations | 256 |
Number of Pins | 256 |
Pin Count | 256 |
Sync/Async | Synchronous |
Length | 17mm |
Width | 17mm |
Height Seated (Max) | 1.7mm |
I/O Type | COMMON |
Min Supply Voltage | 2.4V |
Frequency | 133MHz |
Frequency (Max) | 133MHz |
Subcategory | SRAMs |
Max Supply Voltage | 2.6V |
Package / Case | BGA |
Word Size | 36b |
Memory Type | RAM, SDR, SRAM |
Standby Current-Max | 0.06A |
Access Time | 4.2 ns |
Nominal Supply Current | 1.12A |
Max Supply Current | 1.12A |
Density | 36 Mb |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Organization | 1MX36 |
Thickness | 1.76mm |
Address Bus Width | 40b |
Memory Size | 4.5MB |
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