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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Ports | 2 |
| Number of Functions | 1 |
| RoHS Status | RoHS Compliant |
| ECCN Code | EAR99 |
| Pbfree Code | yes |
| Radiation Hardening | No |
| Surface Mount | YES |
| Moisture Sensitivity Level (MSL) | 3 |
| Min Operating Temperature | -40°C |
| Memory Width | 16 |
| Technology | CMOS |
| Factory Lead Time | 16 Weeks |
| Peak Reflow Temperature (Cel) | 260 |
| Max Operating Temperature | 85°C |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Max Supply Voltage | 3V |
| Packaging | Tape & Reel |
| Supply Voltage | 1.8V |
| Min Supply Voltage | 1.8V |
| Published | 2008 |
| Terminal Pitch | 0.5mm |
| Number of Terminations | 100 |
| Number of Pins | 100 |
| Pin Count | 100 |
| Temperature Grade | INDUSTRIAL |
| Terminal Position | BOTTOM |
| Interface | Parallel |
| Terminal Form | BALL |
| JESD-609 Code | e1 |
| Output Characteristics | 3-STATE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| I/O Type | COMMON |
| Subcategory | SRAMs |
| Memory Size | 16kB |
| Memory Type | RAM, SDR, SRAM |
| Access Time | 65 ns |
| Density | 128 kb |
| Supply Current-Max | 0.07mA |
| Address Bus Width | 26b |
| Package / Case | TFBGA |
| Organization | 8KX16 |
| Standby Current-Max | 0.000008A |
*The following components have specifications similar
*The following five components have specifications similar
