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*The following are the basic parameters of the product, involving the characteristics of the product and its category
TYPE | DESCRIPTION |
---|---|
Number of Ports | 2 |
Number of Functions | 1 |
RoHS Status | RoHS Compliant |
ECCN Code | EAR99 |
Pbfree Code | yes |
Radiation Hardening | No |
Surface Mount | YES |
Moisture Sensitivity Level (MSL) | 3 |
Min Operating Temperature | -40°C |
Memory Width | 16 |
Technology | CMOS |
Peak Reflow Temperature (Cel) | 260 |
Max Operating Temperature | 85°C |
Published | 2011 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Max Supply Voltage | 3V |
Packaging | Tape & Reel |
Supply Voltage | 1.8V |
Min Supply Voltage | 1.8V |
Terminal Pitch | 0.5mm |
Number of Terminations | 100 |
Number of Pins | 100 |
Pin Count | 100 |
Temperature Grade | INDUSTRIAL |
Terminal Position | BOTTOM |
Interface | Parallel |
Terminal Form | BALL |
JESD-609 Code | e1 |
Output Characteristics | 3-STATE |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
I/O Type | COMMON |
Subcategory | SRAMs |
Memory Size | 8kB |
Memory Type | RAM, SDR, SRAM |
Access Time | 65 ns |
Density | 64 kb |
Address Bus Width | 24b |
Supply Current-Max | 0.07mA |
Package / Case | TFBGA |
Organization | 4KX16 |
Standby Current-Max | 0.000008A |
*The following components have specifications similar
*The following five components have specifications similar