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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Through Hole |
| Number of Functions | 1 |
| Surface Mount | YES |
| Part Status | Obsolete |
| Packaging | Tray |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Supply Voltage | 1.8V |
| Power Supplies | 1.8V |
| Terminal Pitch | 1.27mm |
| Terminal Position | BOTTOM |
| Memory Width | 36 |
| Memory Interface | Parallel |
| Output Characteristics | 3-STATE |
| Memory Type | Volatile |
| Length | 25mm |
| Clock Frequency | 250MHz |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 1.7V |
| Factory Lead Time | 28 Weeks |
| Supply Voltage-Max (Vsup) | 1.9V |
| Number of Pins | 165 |
| Number of Terminations | 165 |
| Qualification Status | Qualified |
| Voltage – Supply | 1.7V~1.9V |
| Operating Temperature | -55°C~125°C TA |
| Width | 21mm |
| HTS Code | 8542.32.00.41 |
| Additional Feature | PIPELINED ARCHITECTURE |
| ECCN Code | 3A991.B.2.A |
| Supply Current-Max | 1.7mA |
| I/O Type | SEPARATE |
| Screening Level | MIL-STD-883 |
| Memory Size | 72Mb 2M x 36 |
| Technology | SRAM – Synchronous, QDR II+ |
| Height Seated (Max) | 5.38mm |
| Organization | 2MX36 |
| Memory Density | 75497472 bit |
| Access Time (Max) | 0.85 ns |
| Standby Current-Max | 0.66A |
| Package / Case | 165-BFCCGA |
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