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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Number of Functions | 1 |
| RoHS Status | Non-RoHS Compliant |
| Surface Mount | YES |
| Operating Temperature (Min) | -55°C |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Operating Temperature (Max) | 125°C |
| Technology | CMOS |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1.27mm |
| Memory Width | 18 |
| Terminal Position | BOTTOM |
| Temperature Grade | Military |
| Terminal Form | UNSPECIFIED |
| Length | 25mm |
| Supply Voltage-Min (Vsup) | 1.7V |
| Operating Mode | SYNCHRONOUS |
| Supply Voltage-Max (Vsup) | 1.9V |
| Parallel/Serial | PARALLEL |
| Number of Terminations | 165 |
| Qualification Status | Qualified |
| Width | 21mm |
| HTS Code | 8542.32.00.41 |
| Additional Feature | PIPELINED ARCHITECTURE |
| Height Seated (Max) | 5.38mm |
| Organization | 4MX18 |
| Memory Density | 75497472 bit |
| Total Dose | 300k Rad(Si) V |
| Memory IC Type | QDR SRAM |
| ECCN Code | 9A515.E |
| JESD-30 Code | R-CBGA-X165 |
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