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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| RoHS Status | ROHS3 Compliant |
| Mounting Type | Surface Mount |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Radiation Hardening | No |
| Surface Mount | YES |
| JESD-609 Code | e3 |
| Number of Pins | 8 |
| Number of Terminations | 8 |
| Packaging | Tube |
| REACH SVHC | No SVHC |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Min (Vsup) | 2.5V |
| Factory Lead Time | 4 Weeks |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Supply Voltage-Max (Vsup) | 5.5V |
| Operating Temperature | -40°C~85°C TA |
| Height | 1.25mm |
| Published | 2003 |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) |
| Width | 3.9mm |
| Length | 4.9mm |
| Nominal Supply Current | 10mA |
| Memory Type | Non-Volatile |
| Interface | SPI |
| Clock Frequency | 20MHz |
| Terminal Finish | Matte Tin (Sn) – annealed |
| Word Size | 8b |
| Parallel/Serial | SERIAL |
| Address Bus Width | 16b |
| Sync/Async | Synchronous |
| Voltage – Supply | 2.5V~5.5V |
| Access Time | 25 ns |
| Memory Format | NVSRAM |
| Technology | NVSRAM (Non-Volatile SRAM) |
| Memory Size | 512Kb 64K x 8 |
| Density | 512 kb |
| Memory Interface | SPI – Dual I/O |
| Base Part Number | 23LCV512 |
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