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*The following are the basic parameters of the product, involving the characteristics of the product and its category
| TYPE | DESCRIPTION |
|---|---|
| Part Status | Active |
| Surface Mount | NO |
| Output Enable | NO |
| Reverse Pinout | NO |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Mounting Type | Through Hole |
| Number of Functions | 1 |
| JESD-609 Code | e3 |
| Number of Terminations | 8 |
| Memory Width | 8 |
| Terminal Position | DUAL |
| Packaging | Tube |
| Qualification Status | Not Qualified |
| Terminal Pitch | 2.54mm |
| Technology | CMOS |
| Published | 2012 |
| Factory Lead Time | 7 Weeks |
| Width | 7.62mm |
| Operating Temperature | -40°C~125°C TA |
| Output Characteristics | 3-STATE |
| Memory Type | Volatile |
| Terminal Finish | Matte Tin (Sn) – annealed |
| Clock Frequency | 16MHz |
| Memory Format | SRAM |
| Supply Voltage-Min (Vsup) | 1.7V |
| Standby Voltage-Min | 1.7V |
| Parallel/Serial | SERIAL |
| Supply Voltage-Max (Vsup) | 2.2V |
| Operating Mode | SYNCHRONOUS |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Peak Reflow Temperature (Cel) | NOT APPLICABLE |
| Time@Peak Reflow Temperature-Max (s) | NOT APPLICABLE |
| JESD-30 Code | R-PDIP-T8 |
| Supply Current-Max | 0.01mA |
| Memory Interface | SPI – Quad I/O |
| Memory Size | 1Mb 128K x 8 |
| Access Time (Max) | 32 ns |
| Height Seated (Max) | 5.334mm |
| Memory Density | 1048576 bit |
| Organization | 128KX8 |
| Length | 9.271mm |
| Power Supplies | 1.8/2V |
| Voltage – Supply | 1.7V~2.2V |
| I/O Type | COMMON/SEPARATE |
| Standby Current-Max | 0.000012A |
| Base Part Number | 23A1024 |
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